Abstract
Fine particles can be self-assembled along arbitrary pattern on a substrate with the combination of dispensing suspension that contains particles and motored-stage. The particles assembled along spiral curve can be transferred to another substrate using resin coated on it. The transferred structure works as polishing tool which enables both of efficient discharge of chips due to hydrodynamic flow with rotation and constant cutting edge height because the height distribution is copied from the mirror-polished substrate for assembly. Silica particles with diameter of 1 μm were assembled and transferred. Then, the machining performance was evaluated.
