Proceedings of JSPE Semestrial Meeting
2012 JSPE Spring Conference
Session ID : J15
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Host: The Japan Society for Precision Engineering

Influence of circulative slurry flow on polishing characteristics
*Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
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Keywords: CMP, silicon wafer, polishing pad, removal rate, slurry flow, planarization
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[in Japanese]
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© 2012 The Japan Society for Precision Engineering
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