Proceedings of JSPE Semestrial Meeting
2015 JSPE Spring Conference
Session ID : E44
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Host: The Japan Society for Precision Engineering

A study on ductility mode slicing of SiC by multi-wire saw
*Kazuhei Matsukawa, Hitoshi Suwabe, Ken-ichi Ishikawa
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Keywords: slicing, multi-wire saw, rocking vibration, slicing characteristic, resin corted-wire, Diamond grain
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[in Japanese]
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© 2015 The Japan Society for Precision Engineering
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