Proceedings of JSPE Semestrial Meeting
2019 JSPE Autumn Conference
Conference information

Host: The Japan Society for Precision Engineering

Name : 2019 JSPE Autumn Conference

Location : [in Japanese]

Date : September 04, 2019 - September 06, 2019

Study on grain actions of diamond lapping using copper plate
*Yuki Kagi, Hitoshi Suwabe, Ken-ichi Ishikawa
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Keywords: Lapping, Grain action, Visualization of slurry flow, Diamond abrasive grain
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 52-53

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Abstract

[in Japanese]

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© 2019 The Japan Society for Precision Engineering
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