Detection and analysis of thermal evanescent waves on ultra-thin metal films

Abstract

The development of faster and more powerful computing is associated with requirement of increasing device density and progressive device miniaturization. However, shrinking size and escalating density has enhanced computing ability at the cost of increasing heat generation on the integrated board. Therefore, an effective heat transfer system is vital to keep electronic devices cool, which is a critical factor in determining their speed, efficiency and reliability. Thermal evanescent waves, which is generated by random motion and collision of free electrons on the metal surface and mainly located in the surface vicinity within 100 nm, can carry a large amount of heat and make heat transfer possible. When metal thickness is thinner than around 20 nm, metallic features, such as conductivity and dielectric function, change as thickness decreases. The objective of our study is to investigate the relationship between metal thickness and intensity of thermal evanescent waves. Now we have learned there is a positive relationship between gold films’ thickness and intensity of thermal evanescent waves when thickness is under approximately 10 nm because some cracks are generated. To obtain smoother sample surface, we utilize new material like Nickel to make samples, and further study the relationship more precisely.