Host: The Japan Society for Precision Engineering
Name : 2023 JSPE Spring Conference
Location : [in Japanese]
Date : March 14, 2023 - March 16, 2023
Pages 635-636
We have developed an etching technique of diamond substrates using a Ni mold, which has high-temperature solid solubility limit of carbon. The diamond etching speed was approximately 1 µm/h. High-speed etching of diamond will contribute to the fabrication of diamond heatsink.