Proceedings of JSPE Semestrial Meeting
2023 JSPE Spring Conference
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Etcing of diamond substrate using Ni mold
*Takashi MatsumaeHideaki NishimoriYuichi KurashimaHideki Takagi
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Keywords: diamond, etching
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 635-636

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Abstract

We have developed an etching technique of diamond substrates using a Ni mold, which has high-temperature solid solubility limit of carbon. The diamond etching speed was approximately 1 µm/h. High-speed etching of diamond will contribute to the fabrication of diamond heatsink.

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© 2023 The Japan Society for Precision Engineering
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