Observation of copper pulse plating behavior by microfluidic channels (1)

Abstract

In recent years, the miniaturization of interconnections has been progressing to improve the performance of integrated circuits. As a result, the mechanical burden on the interconnections is increasing, and the mechanical strength of the interconnections is becoming more important to maintain reliability. It is known that there is a correlation between tensile strength and hardness of metals. In this study, we sought plating conditions with small crystal grains and high hardness by using pulsed current and micro channels. The results showed that the longer the off-time and the higher the plating current, the smaller grains were maintained.