The mechanism of the nanoscale cutting using the self-excited microcantilever

Abstract

Nowadays, microfabrication techniques such as laser processing and etching processing are wildly applied. However, due to the divergence of the focus points and too much reliance on extreme chemical environments, there are limitations in the above methods to achieve higher fabrication accuracy. To break the limitation, the nanoscale cutting is based on the basic cutting principle using a microcantilever with a diamond abrasive glued to the tip as the cutting was once proposed. And subjecting self-excited vibration to the microcantilever has proven to be more efficient in cutting. In the previous research, the cutting amount that could be controlled by the amplitude of the vibrated cantilever has been clarified. To figure out the mechanism of the vibration cutting, the shape of the vibration mode of the self-excited microcantilever when its tip is pressed on the workpiece is investigated. As we know the vibration mode of the microcantilever, the motion of the diamond can be derived, thus the working principles of the cutting process and the cutting amount control are figured out.