Development of monitoring technology for process-affected layers using electrical resistance in power device polishing (first report)

Abstract

In power device polishing, long polishing times are required to remove the damaged layer that occurs on the surface during the previous processing step, so it is important to manage the damaged layer. Conventionally used measurement methods generally involve measurements using a microscope, etc., but there are issues such as having to stop the machining process and requiring time for measurement. In this study, we are working on a measurement method that focuses on electrical resistance as a method for monitoring the amount of damaged layer in a short period of time. We will introduce the current situation.