2002 Volume 10 Issue 3 Pages 85-89
In order to evaluate the gluing condition of a product, peeling test has been generally used. But in this study, such a test cannot be used because the resin base pate is in a film state, so its strength is weaker than the glue itself. It was therefore tried to find the possibility of using a non-destructive test by observing electric characteristic. Since the glue and resin base plate are sandwiched by a copper plate and a metallic pattern, it was considered as a condenser. Therefore, the function was defined that capacity and area must be proportional. The result of this study showed a good reproducibility on the gain. Such evaluation can be applied for the evaluation of gluing strength where destructive tests have been used.
