QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Evaluation by Ultrasonic Testing and TEM Observation of Bond Interface for Ultrasonic Bonds of 5052/SUS304 and 5052/SPCC
Hamed ABDEL-ALEEMMitsuaki KATOHKazumasa NISHIOTomiko YAMAGUCHITSUE Yusuke TSUE Yusuke
Author information
JOURNALS FREE ACCESS

2005 Volume 23 Issue 2 Pages 194-202

Details
Abstract

We tried to bond two dissimilar combinations, 5052/SUS304 and 5052/SPCC, by ultrasonic spot bonding. The bondability of bonds was evaluated by performing ultrasonic testing and tensile shear test. In principle, good bonding was obtained by ultrasonic bonding without developing any intermetallic compounds. A good correlation between results of ultrasonic testing and tensile shear test could be obtained by selecting the appropriate threshold level in the ultrasonic testing. The microstructure in nano-scale order was observed near the bond interface using TEM to make clear the mechanism of the bonding. We could notice that amorphous structure was developed near the bond interface and this contributed the good bonding of the dissimilar materials by ultrasonic bonding.

Information related to the author
© 2005 by JAPAN WELDING SOCIETY
Previous article Next article
feedback
Top