QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Heat dissipative Pb-free Bonding Technology Using Al-rich Zn/Al/Zn Clad Solder
Takuto YAMAGUCHITomotake TOHEIOsamu IKEDAShohei HATAYuichi ODAKazuma KUROKIHiromitsu KURODAAkio HIROSE
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2015 Volume 33 Issue 2 Pages 171-179

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Abstract

Al-rich Zn/Al/Zn clad solder were developed as Pb-free solder for a die-attachment. The Zn/Al/Zn clad solder was produced by clad rolling of Zn and Al strips in order to prevent Al from oxidation and improve wettability. The Zn/Al/Zn clad solder melted at 382°C after solid-state interdiffusion of the Zn and Al layers. Bonding was successfully achieved with bonding pressure of a few kPa. Thermal cycle life of Invar-to-Cu substrate joint using the Zn/Al/Zn clad solder was longer than that of Pb-Sn-Ag solder. No kirken-dall voids were observed in the vicinity of the bonded interface after aging at 250°C for 1000 h.

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© 2015 by JAPAN WELDING SOCIETY
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