JOURNAL OF THE JAPAN WELDING SOCIETY
Online ISSN : 1883-7204
Print ISSN : 0021-4787
ISSN-L : 0021-4787
Study on the Soft Soldering
I. OnishiM. MizunoT. Hikita
Author information
JOURNAL FREE ACCESS

1953 Volume 22 Issue 7 Pages 227-231

Details
Abstract

Pb-Sn alloys of various compositions were used as soft solders for the research Each 0.1 g of solder was put on thin copper plate which preheated to a desired temperature in the thermostat 0.5 c c of zinc-chloride solution or other fluxes was applied on the solder by pipette. Then the spread area of solder was determined by the planimeter.
(1) A maximum spread area was found at the solder of eutectic composition.
(2) In all kinds of compositions of the solders a maximum spread area was obtained at 260°C when the saturated solution of zinc-chloride was used as a flux.
Some interesting problems about the soft soldering was found in the experiment and described in this paper.

Content from these authors
© by JAPAN WELDING SOCIETY
Previous article Next article
feedback
Top