JOURNAL OF THE JAPAN WELDING SOCIETY
Online ISSN : 1883-7204
Print ISSN : 0021-4787
ISSN-L : 0021-4787
The Study on Flux Action of Soldering (Report 4)
On the Dissolution
Hiroshi KiharaIkuo OkamotoAkira OmoriHirohumi NakanoYoshio Aoyama
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1974 Volume 43 Issue 2 Pages 180-188

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Abstract

In this report, the effect of dissolution of metal into solder on spreadability was studied. The experimental results obtained are as follows:
The active metal atom, produced by the reaction of molten Sn-Pb eutectic alloy solder with various metal stearates, dissolves easily into molten Sn-Pb alloy solder, and the dissolution may be most important factor in spreading of solder on the base metal.
But, the addition of various metal to Sn-Pb alloy solder and the dissolution of base metal into solder, had little effect on improvement of spreading of Sn-Pb alloy solder.

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© by JAPAN WELDING SOCIETY
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