1974 Volume 43 Issue 2 Pages 180-188
In this report, the effect of dissolution of metal into solder on spreadability was studied. The experimental results obtained are as follows:
The active metal atom, produced by the reaction of molten Sn-Pb eutectic alloy solder with various metal stearates, dissolves easily into molten Sn-Pb alloy solder, and the dissolution may be most important factor in spreading of solder on the base metal.
But, the addition of various metal to Sn-Pb alloy solder and the dissolution of base metal into solder, had little effect on improvement of spreading of Sn-Pb alloy solder.