1976 Volume 45 Issue 8 Pages 657-664
As a basic research of diffusion welding, a diffusion process of interlayer metal near the bonded interface and the mechanical properties of the bonded specimens were investigated. Experiments were made in the several combinations of base metals and interlayer metals which had either a continuous solid solubility or a limited solubility. A summary of the results obtained were as follows;
1. Weldability, such as tensile strength and reduction of area, of copper bonded by inserting a gold foil being a continuous solid solubility for copper were superior to those which was bonded directly without any interlayer metals and those which was bonded by inserting a silver foil having a limited solubility for copper.
2. For the improvement of the weldability in diffusion welding, it is desirable to use interlayer metals which diffuse to a greater extent into base metals.
3. Apparent diffusion coefficients of interlayer metals into base metals were estimated by neglecting the dependence on concentration. As the results, at a relatively low temperature range the apparent diffusivities obtained were much larger than impurity diffusion coefficients for the attribution to boundary diffusion, but at a high temperatuer range the apparent diffusion coefficients approach to the impurity diffusion coefficients.