QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Online ISSN : 2434-8252
Print ISSN : 0288-4771
Investigation on Optimal Thickness of Plating Layers and Reliability of Bonds with Low Temperature Bonding Process
Bonding Phenomena and Process Control on Electronic Materials
Young-eui ShinDai NakajimaShuji Nakata
Author information
JOURNAL FREE ACCESS

1993 Volume 11 Issue 2 Pages 347-352

Details
Abstract

New microsoldering process has been researched and developed by inserteing Sn/In and Sn plating layers at the bonding interface preliminary without both additional solder and flux.
This paper clarified In roles is improvement of bonding strength and ductility of Sn-In diffusion reaction layers at the bonds.
The bondability is improved as supply of In plating layers of thickness of 1 to 3μm on the Sn plated Cu alloy lead of thickness of 2 to 10μm, and also it makes possible bonding such as low heating temperature which is tip temperature of 500 to 650 K.
Furthermore, this paper showed experimentally to the optimal thickness of plating layers and the possibility of fine pitch, multi-lead mounting in bonding process.
The good reliability of the bond is clarified by both high temperature storage and whisker test.

Content from these authors
© by JAPAN WELDING SOCIETY
Previous article Next article
feedback
Top