Abstract
In recent years, resistance reflow-soldering method has been applied to the connection between solder-plated PCB (printed circuit board) and thin insulated wire to allow high-density assembling of high-perfomance electronics equipument. Extensive investigation of reflow conditions, and evaluation of strength and reliabilty of the microconnection are required because the wire is soldered without physically removing the insulation.
(1) Quick heating and quick cooling, less than 0.3 s, is the key in realizing ideal microconnection, with the insulation thermally removed.
(2) Realizing qiuck heating and cooling requires a tip contact pressure of 800N/cm2 (weight : 2N) and a proper amount of solder on the pad.
The result of our evaluation of field sample boards indicates that the microconnections which were soldered by this soldering method did not age even after 10 years of field operation.
