Reaction Layer Growth in AlN to Molybdenum Joint Brazed using Ag-Cu-Ti Filler Metal

Study on Bonding of Aluminum Nitride to Metals (Report 2)

Abstract

The reaction layer growth in AlN-molybdenum joint during brazing operation was investigated at 1073-1173 K for 0-129.6 ks using Ag-Cu-Ti filler metal. The thickness of reaction layer formed at the bonding interface was increased with increasing the bonding temperature and holding time. It was elucidated that the reaction layer growth could be expressed by Johnson-Mehl type equation with time exponent 'n' of 1/2 which was derived from the parabolic growth law by considering the consumption effect of diffusing element in the reaction layer. The apparent activation energy for the reaction layer growth was 68.9 kJ/mol. It may be deduced that the bonding phenomena and mechanism of AlN to metals were similar to those of Si₃N₄ to metals using active brazing method.