QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Relation between Impurities (Au Plating) and Joints Quality
Influence of Plating on Micro Joints Quality
Hideaki SasakiShinichi KazuiTatsumi ShibataRyosuke Morinari
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1994 Volume 12 Issue 4 Pages 588-590

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Abstract

Parallel gap resistance welding of Ag plated 0.18 mm diameter oxygen free copper wires to Au+ Ni plated of Printed circuit boards (P/B) was investigated (concerning Au plating). The results are summarized as follows.
(1) Au plating bath for Good Micro Welding is composed Cobaltion 0.35-3 gf/l [5.9-51 mol/m3] and Nickelion 0.02-0.5 gf/l [0.34-8.5 mol/m3], after Au plate it's composition of Co 0.2-3% and Ni 0.4-2% except Au :
(2) Cobalt content and Nickel content beyond the allowable limit are Bad Welding for Au plating, they cause Blow hole in the weld fillet and decrease weld strength.

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