QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Reliability of Parallel Gap Micro Joints of Fine Wire to Solder Plated Printed Circuit Board
Hideaki SasakiShinichi KazuiTatumi Shibata
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1994 Volume 12 Issue 4 Pages 591-599

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Abstract

Parallel gap resistance welding of Ag plated 0.18 mm, 0.26 mm diameter oxygen free copper wires to solder plated printed circuit boards (Edge card for computer tape cable) was investigated.
The Results are summarized as follows
(1) Optimum welding condition was estabilished (gap of electrode, electrode wear and weld voltage).
(2) Computer's tape cables have been produced by Automatic tape cable assemble line was producted computer's tape calbe.
(3) Developed welding method gave sataisfactory results (5×108 weld points for 20 years were no trouble).
(4) Quality control of parallel gap was estabilished (Purchasing parts Inspection, manufacturing quality control, improvent activites, shipment quality).

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