QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Measurement of Adhesion force between Gold and silicon
Ryoji MizunoKunio TakahashiTadao Onzawa
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1996 Volume 14 Issue 3 Pages 523-526

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Abstract

A measurement system was developed to measure adhesion forces between solids. Adhesion forces were measured in an ultra high vacuum (UHV) chamber of an Auger electron spectroscopy (AES). Contacts were made between a silicon wafer and a gold sphere with a radius of about 200μ m. The specimens were sputtered by argon ion before the contacts. No adsobates were observed in Auger spectra obtained from the sputtered surfaces, although the ion sputtering could induce some damages on their surface.
In the present study, we discuss the influence of the ion sputtering on the adhesion forces. The adhesion forces were measured after the ion sputtering as a function of the applied load from 0 to 1000μN. The adhesion forces obtained after the 3 kV-3.6 ks sputtering were larger than measured after the 1 kV-3.6 ks sputtering. The adhesion forces measured after the 1 kV-10.8 ks sputtering were larger than measured after the 1 kV-3.6 ks sputtering. Assuming the elastic theory, it can be intepreted that the surface energy of materials changes under conditions of the ion sputtering.

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