Prediction Algorithm for The Time Required to Complete The Interfacial Adhering Process

Support System for Prediction of Solid State Diffusion Bonding (Part 2)

Abstract

The algorithm for predicting the intimate contact process in the solid state diffusion bonding has been developed. The numerical model proposed in our previous study (Part 1) was updated to predict the void shrinkage process in the final stage of bonding.
The influence of dispersion of void spacing on the contacting process was examined based on the calculated results. The plural measurements of surface profiles was performed to estimate the variation of the bonding process. The distribution of void spacing estimated by the overlap method was also examined. It was useful to take into account the largest void spacing and the largest void volume for the prediction of the final stage. The algorithm was verified experimentally. It was indicated that the algorithm predicts the time taken to attain the full contact.