Metallizing of Aluminum Nitirde by Ion Plating Technique

Bonding of Aluminum Nitride to Copper using Surface Modification Technique (Report 2)

Abstract

Metallization method of AlN substrate by ion plating technique has been developed. Dual coating films of 5-10 μm thick nitrides (TiN, ZrN and CrN) and 10 μm thick copper were formed on the AlN substrate by ion plating. The functionally gradient films of TiN Ti were also deposited on the AlN substrate. The adherent strength of metallized films against AlN substrate was evaluated by the tensile test at room temperature. The morphologies of nitride films were quite sound and they were stuck AlN together well. Element analyses by EPMA and ESCA revealed that nitrides such as TiN, ZrN and CrN were hardly reacted with AlN substrate or Cu film. The adherent strength of TiN, ZrN, CrN coating film and the functionally gradient films indicated the average values of 50-60 MPa in any cases. The joint strength of TIN+Cu dual metallized AlN to copper soldered by Sn-38 mass%Pb solder was about 33 MPa.