QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Resistance Heating Bonding of Copper Wires with Insulation Coating Using Tin Plated Copper Terminal
Takashi HARAMAKIMitsuo NAKAMURAKatsuyoshi TERAKADO
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1997 Volume 15 Issue 3 Pages 553-558

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Abstract

A new brazing method was developed and investigated in order to improve the bonding strength of insulated copper wires using fusion technology. The process was composed of fusing and press-soldering, which was a direct joining of copper terminal and insulated copper wire. Insulated copper wires wrapped with a tin plated copper terminal were heated simultaneously by resistance heating to be bonded. The tin plating layer was used for press-soldering.
The room temperature tensile strength increased with resistance heating current until above 3.0 kA and the fracture in base metal occurred in the copper wires, for bonding above a current of 4.2 kA. In the elevated temperature tensile testings, rupture in base metal were observed at 150°C and 250°C. The results showed excellent thermal resistance of the joints.

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