Diffusion Bonding of Tungsten to Titanium

Abstract

We investigated the influences of bonding parameters on joint strengths of diffusion bonds between swaged tungsten and titanium (case A), and between rolled tungsten and titanium (case B). In case of A, joints bonded at temperatures of 1073 K and 1473 K for a bonding time of 1.8 ks showed the tensile strengths of 120 MPa. The joint strength obtained at a bonding temperature of 1073 K increased with increase of bonding times, and for a bonding time of 30 ks reached about 240 MPa, which was 88% of the tensile strength of the tungsten base metal. In the case of B, joint strength obtained at a bonding temperature of 1173 K was 16 MPa, when fracture occurred along grain boundaries. In the both case, the voids were formed in titanium base metal away from the W/Ti interface. It is therefore seemed that the existence of voids give no effect on the joint strength.