Abstract
A two-dimensional model for solid state bonding process is proposed. The bonding process is assumed to be achieved by four fundamental mechanisms: plastic deformation, creep deformation, interface diffusion and volume diffusion. The numerical analysis based on this model makes it possible to understand quantitatively the effects of temperature, pressure, bonding time, asperity of faying surface on the bonding process. Besides, it is possible to estimate the relative contributions of the four bonding mechanisms to the percent bonded area. It is found from the analysis that the deformation mechanisms tend to be dominant with increasing temperature. The tendency is striking under high pressures.
