A Quantitative Analysis of Solid State Bonding Process Based on Fundamental Bonding Mechanisms (Part 2)

Verification of the bonding model by experiment

Abstract

The two-dimensional model of bonding process proposed in our previous report (Part 1) was experimentally verified, using an oxygen-free copper as material for bonding tests. The boundary conditions in the bonding tests were settled in accordance with the two-dimensional model. The ranges of test conditions (bonding time, pressure and temperature) were determined by the numerical calculations. The experimental results are in good agreement with the calculated results. It is also found that the bonded interface (bond-line) does not migrate during bonding even if the percent bonded area roughly attains to 100%. It is, therefore, considered that the two-dimensional model proposed in Part 1 can be appropriate to actual solid state bonding process.