Fundamental Study on Si₃N₄-Metal Bonding using Cu-Base Alloys as the Insert Metal

Study on Bonbing of Heat-Resisting Fine Ceramics (Report 3)

Abstract

Bonding of Si₃N₄ to metal using liquid insert metals of Cu-base binary alloys containing Cr, Nb, V, Ti or Zr was conducted in vacuum of about 6 mPa. Joint strength was evaluated by tensile-shear tests. The heighest strength of Si₃N₄ to W joints bonded using Cu-5%Cr, Cu-1 %Nb, Cu-3%V, Cu-5%Ti and Cu-10%Zr insert metals were about 150 MPa, 140 MPa, 140 MPa, 180 MPa and 180 MPa, respectively. Effect of bonding conditions on area fraction of void in Si₃N₄ to W joints was investigated. Area fraction of void increased with increasing bonding temperature and holding time. It was considered that formation of void was mainly caused by outflow or vaporization of insert metal.