蒸着薄膜および電着メッキ層の残留応力解析

豊田 政男; 吹田 義一; 平野 俊雄; 中村 茂昭; 山本 斌曠; 草薙 一正; 三谷 英機

doi:10.2207/qjjws.7.543

Analysis of Residual Stresses in Evaporated and Plating Films

Masao Toyoda, Yoshikazu Suita, Toshio Hirano, Sigeaki Nakamura, Yoshihiro Yamamoto, Kazumasa Kusanagi, Hideki Mitani

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Keywords: Thin film, Residual stress, Evaporated film, Plating film, Multilayered structure, Inherent strain

JOURNAL FREE ACCESS

1989 Volume 7 Issue 4 Pages 543-548

DOI https://doi.org/10.2207/qjjws.7.543

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Abstract

This paper is concerned with the theoretical evaluation of residual stresses in multilayered structures fabricated on substrates, such as evaporated films and plating films.
Firstly, the analysis of thermal stresses in multilayered elastic thin films is carried out by using the method of strain suppression. Next, the theoretical formulas for evaluation of residual stresses arising in thin films and substrates are derived by the use of combining the results of the thermal stress analysis and those of stresses due to the inherent strains of the thin film. Furthermore the controlling parameters of residual stresses are derived theoretically.
Experimental results of residual stresses in evaporated Ag films and hard chrominum plating films agree approximately with theoretical ones.

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