QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Resistance Welding of Fine Wires to Solder Plated Princted Circuit Board
Hideaki SasakiShinichi KazuiTomohiko ShidaTatsumi ShibataRyosuke Morinari
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1990 Volume 8 Issue 4 Pages 493-497

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Abstract

Parallel gap resistance welding of Ag plated 0.18 mm diameter oxygen free copper wires to solder plated prined circuit boards (P/B) was investigated. Results obtained are summarized as follows.
(1) Proper electrode force of weld condition is selected; the electoode force 2.5 kgf (24.5N, at the start of current on) and the maximum electrode force 2.8 kgf (27.4N).
(2) Opteimum Thikness of Solder plating is 15-35μm.
(3) Proper width of the Patterns is 0.8 mm (tolerance±0.1mm).
(4) Electrode material of Cu-W (Cu 30%, W 70%) has seven times longer life than Mo in the number of tolerable continuous welding points. (90°peel welding strength is over 0.3 kgf (2.94N))

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