QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Bonding Mechanism in Transient Liquid Insert Metal Diffusion Bonding Using Alloying Powder
Study on Transient Liquid Insert Metal Diffusion Bonding of Ni-base Superalloys (Part 7)
Yoshikuni NakaoKazutoshi NishimotoKenji ShinozakiChung Yun KangHaruki Shigeta
Author information
JOURNALS FREE ACCESS

1991 Volume 9 Issue 4 Pages 556-561

Details
Abstract

This paper was concerned with mechanism of isothermal solidification process on Transient Liquid Insert Metal Diffusion Bonding of Ni-base superalloys using Ni-base alloying powder. MM007 and IN100 alloys were used for base metals. IN 100 powder sheets were inserted between specimens with MBF-80 insert metal and then specimens were heated up at bonding temperatures of 1398 K.
Content of liquid phase among alloying powders decreased with the lapse of bonding time. On the contrary, content of borides on dendrite boundary in alloying powders increased with the lapse of bonding time. Thermal analysis of mixed alloys with IN 100 and MBF-80 showed the possibility of crystalizing of borides in alloying powders during isothermal solidification process.
It was believed concerning with the mechanism of isothermal solidification process that boron in liquid phase was consumed due to boride crystalizing in alloying powder and subsequently solid phase growth occurred in liquid phase.

Information related to the author
© by JAPAN WELDING SOCIETY
Previous article Next article
feedback
Top