The Journal of Reliability Engineering Association of Japan
Online ISSN : 2424-2543
Print ISSN : 0919-2697
ISSN-L : 0919-2697
Electromigration Phenomenon of Copper Interconnects on Semiconductor Device
Masashi HAYASHI, Shinji NAKANO, Tetsuaki WADA
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2003 Volume 25 Issue 2 Pages 110-120

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[in Japanese]

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© 2003 Reliability Engineering Association of Japan
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