The Journal of Reliability Engineering Association of Japan
Online ISSN : 2424-2543
Print ISSN : 0919-2697
ISSN-L : 0919-2697
Case study of DfE (Design for Environment) by QFDE (Quality Function Deployment for Environment) for IC package
Mitsuru KobayashiTomohiko SakaoKeijiro MasuiAtsushi Inaba
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2005 Volume 27 Issue 3 Pages 205-218

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Abstract
QFDE (Quality Function Deployment for Environment) that added an environment lateral item to QFD (Quality Function Deployment) was studied about the IC package. As the results, the most important components considering the environment could be identified in the package fabrication process, and DfE (Design for Environment) could be available for environment load reduction to satisfy the quality and reliability demand from the early stage of designs level to assembled products.
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© 2005 Reliability Engineering Association of Japan
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