Proceeding of Symposium on Reliability
Online ISSN : 2424-2357
ISSN-L : 2424-2357
2011Spring.19
Session ID : 3-3
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3-3 Evaluation of degradation at a solder connected point due to electromigration
*Akihiro HIGUCHI, Kazunori HIRAOKA
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[in Japanese]
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© 2011 Reliability Engneering Association of Japan
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