SEISAN KENKYU
Online ISSN : 1881-2058
Print ISSN : 0037-105X
ISSN-L : 0037-105X
Research Flash
3-D Microsystem Packaging for Interconnecting Electrical, Optical and Mechanical Microdevices to The Eexternal World.
Jean-Philippe GOUY, Agnès TIXIER, Yoshio MITA, Satoshi OSHIMA, Hiroyuki FUJITA
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2001 Volume 53 Issue 2 Pages 108-111

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© 2001 Institute of Industrial Science The University of Tokyo
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