Research for Advancement of MID Technologies

Abstract

   MID (Molded Interconnect Devices) had been developed as three dimensional circuit boards, and, currently, are used as functional devices such as multiband antennas in cellular phones. Aiming at application of MID to mechatronic devices such as actuators and sensors, the authors research on novel production technologies required for the purpose. This paper reports a circuit structuring methods on shadowed surface, its application to an electrostatic actuator and another novel production method using sacrificial material.