Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Micro-Connection for IC Bonding Using Electroless Plating
Yuji NISHITANI, Hisashi HAYAKAWA, Ken ORUI, Hiroko JINNO, Hiroshi ASAMI
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Keywords: Electroless Plating, Micro-Connection, SIP, Flip Chip Bonding
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2003 Volume 54 Issue 2 Pages 108-111

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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