Abstract
In this study, we investigated composite plating of Ni-SiC by pulse current elelctrolysis using pyridinium (AZPy) and trimethyl ammonium (AZTAB) surfactants with an azobenzene group. The SiC content of Ni/SiC plating using 1μm SiC particles increased with an increase in the pulse frequency from 40vol.% to 60vol.%. This value increased to more than 70vol.% for 0.27μm SiC particles. The roughness of the plating for 1μm SiC particles decreased with an increase in the pulse frequency from 1.7μm to 0.5μm. This value decreased to 0.3μm for 0.27μm SiC particles, which is close to that of the substrate. The hardness of the Ni/SiC plating depended on the SiC content and the highest value obtained was 780Hv. This value was increased to 1340Hv by heat treatment of Ni-P/SiC plating.
