Improvement of Electroplated Copper Films by Annealing in Supercritical Fluid

Journal of The Surface Finishing Society of Japan

Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869

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Improvement of Electroplated Copper Films by Annealing in Supercritical Fluid

Kazuyoshi UENO, Yuji SHIMADA, Yoshinori AOKI, Shigeru YOMOGIDA, Seishi AKAHORI, Tomohiko YAMAMOTO, Takamasa YAMAGUCHI, Akiko MATSUYAMA, Takashi YATA, Hideki HASHIMOTO

Author information

Kazuyoshi UENO
Shibaura Institute of Technology
Yuji SHIMADA
Shibaura Institute of Technology
Yoshinori AOKI
Shibaura Institute of Technology
Shigeru YOMOGIDA
KISCO Ltd.
Seishi AKAHORI
Toray Research Center, Inc.
Tomohiko YAMAMOTO
Toray Research Center, Inc.
Takamasa YAMAGUCHI
Shibaura Institute of Technology
Akiko MATSUYAMA
KISCO Ltd.
Takashi YATA
KISCO Ltd.
Hideki HASHIMOTO
Toray Research Center, Inc.

Keywords: Supercritical Fluid, Annealing, Plating, Copper, Integrated Circuit

JOURNAL FREE ACCESS

2010 Volume 61 Issue 8 Pages 583

DOI https://doi.org/10.4139/sfj.61.583

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© 2010 by The Surface Finishing Society of Japan

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