Abstract
Recently, via-filling for the build-up plating process has been studied actively using three organic micro additive agents: polyethylene glycol 4000 as a carrier, bis-(sodium sulfopropyl)-disulfide as a brightener, and Janus Green B as a leveler. Added amounts of these agents are usually used between 10-50 ppm. The filling ability becomes greatly reduced and defective conformal deposition is generated if the concentration of the additives is not used in the proper range. However, simple analytical methods of these additives have remained elusive.
Therefore, we attempted to analyze these additives using flow injection analysis (FIA) with boron doped diamond (BDD) as an electrochemical detection electrode at high applied potential (+2.1 V vs. Ag/AgCl). Results showed that these additives are detectable using elution solutions of FIA to produce high signal and low noise detection. In this report, we describe an easy analytical method for via-filling additives using FIA with BDD.
