Technology of Copper Via Filling

Journal of The Surface Finishing Society of Japan

Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869

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Technology of Copper Via Filling

Tetsuro EDA, Hideki HAGIWARA, Ryoichi KIMIZUKA

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Keywords: Via Filling, Through Hole Filling, Copper Plating, Anylayer, Smartphone

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2011 Volume 62 Issue 8 Pages 382

DOI https://doi.org/10.4139/sfj.62.382

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© 2011 by The Surface Finishing Society of Japan

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