Cross-sectional Observation of Ni-P/Cu Multilayer Films and their Dependence of Wear Resistance with Ni-P/Cu Thickness

Abstract

Several Ni-P/Cu multilayer films of various thicknesses were formed on polycrystalline copper substrates using electrodeposition in a single bath. The Ni-P/Cu bilayer films which were thinner than 50 nm exhibited higher wear resistance than that of a Ni-P single layer. The wear loss of the films decreased concomitantly with increasing Ni-P layer ratio in the Ni-P/Cu bilayer.