Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Recent Trend of Build-Up Dielectric Materials for IC Package Substrates
Genjin MAGO
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Keywords: Build-Up Material, IC Package Substrate, Epoxy Resin, Dielectric Material, Semi-Additive Process
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2014 Volume 65 Issue 8 Pages 349-352

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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