Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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Fundamental Problems of Flip-chip Package and Low Temperature Assembly
Kimihiro YAMANAKA
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Keywords: Flip-chip, Low Temperature Assembly, Low Melting Point Solder, Thermal Cycle, Electromigration
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2018 Volume 69 Issue 3 Pages 102-107

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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