Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Reviews
Effect of Electroless Ni-P / Electrolytic Cu Plating on Solder Joint Reliability under High Temperature Environment of 200 ℃
Satoshi OYA, Saki NAKAKIHARA, Hiroshi ATARASHI
Author information
Keywords: Electroless Ni-P, Electrolytic Cu, Sn-3.0Ag-0.5Cu, Solder Joint Reliability, Power Module
JOURNAL FREE ACCESS

2019 Volume 70 Issue 6 Pages 308-311

Details
Download PDF (3013K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2019 by The Surface Finishing Society of Japan
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

Share this page
feedback
 Top