2020 Volume 71 Issue 8 Pages 521-529
For this study, electroless deposition of aluminum（Al）was examined using baths of AlCl3/LiAH4/ether solvents and catalysts formed on substrate surfaces. Deposition of a thick electroless Al layer requires a Cu substrate, a Ti compound catalyst, and diethyl ether or dibutyl ether solvents. From 15-μm-thick Al deposits obtained from 2 h deposition time, the rate of Al deposition was found to be 15±2 μm h－1. Results show that adding dicarboxylic acids such as glutaric acid and thiomalic acid to the bath can improve the deposited Al surface brightness. As an exemplary application of electroless Al, deposition of Al on the surface of cup-stacked 30-50 nm diameter carbon nanotubes was achieved with a bath including AlCl3/LiAH4/diethyl ether and a Ti catalyst.
