Solder Joint Reliability of Electroless Pd/Au Plating Film Formed with Co Activation

Abstract

Electroless Pd/Au plating was developed for metal finishing applicable to a fine Cu pattern. Conventionally, Pd activation with a substitution reaction is used for the electroless Pd/Au plating process, but a concern persists that the process might degrade the solder joint reliability. Therefore, we newly investigated Co activation with a reduction reaction. Our findings confirmed the improved solder joint reliability.