Analysis of Cyanide-Free Silver Plating Process By Electrochemical Measurement Method

Abstract

Electrochemical measurements were used to examine effects of adding pyrimidine-derivatives（2,4-pyrimidinedione（uracil）and 5-methyluracil（thymine））and hydantoin-derivative（5,5-dimethylhydantoin（DMH））in a cyanide-free silver electroplating solution. From our research, we have discovered that the bonding energy of silver-thymine complex is greater than that of the silver–uracil complex, which leads to larger deposition overvoltage and also smaller amounts of silver deposition during the cathodic potential sweep until reaching the hydrogen generation potential.