Reviews of SFJ Young Researcher Award 2022
Development of New Electroless Precious Metal Plating Process for Fine Pattern and Research on its Surface Mounting Characteristics
Keywords:
Fine Cu Pattern,
Ultra-thin Ni/Pd/Au Plating,
Selective Plating Properties,
Solder Mounting Characteristics,
Wire Bonding Characteristics
2023 Volume 74 Issue 2 Pages 85-91
Details
Article 1st page
