Influence of Plating Thickness and Substrate Pretreatment on Nodule Occurrence in Electroless NiP Deposited Films

Abstract

Nodules during electroless NiP deposition were observed from the initial stage when using palladium catalyst method, but not when using iron strip contact method. When applying either method, the nodules ceased as the deposition thickness increased. Findings indicate that the influence of pretreating the copper substrate was much greater than the influence of sulfur additives in the plating bath.